SPECIFICATION

S/S

D/S & Multilayer

Aluminum PCB

 Laminate Material

 Base Material

XPC/FR-1/FR-2/ CEM-1/CEM-3/ FR-4

CEM-3/ FR-4

Metal Core 1W/2W/ 3W

 Material Thickness

0.60/0.80/1.00/1.20/1.60mm

0.60/0.80/1.00/1.20/1.60mm

0.8/1.00/1.20/1.60mm

 Max finished board size

600 x 450mm

600 x 450mm

1200 x 500mm

 Min Core Thickness

0.60mm

0.60mm

1.00mm

 Min board Thickness

0.60mm

0.60mm

1.00mm

 Min/Max Layer

1-L

Up to 10-L

1-L

 Cu Thickness

1oz/ 2oz

Hoz/ 1oz/ 2oz

Hoz/ 1oz/ 2oz

 Pattern Design

 Min Line width

0.17mm

0.10mm

0.10mm

 Min Spacing

0.20mm

0.10mm

0.10mm

 Min SMT Pitch or Fine Pitch

0.40mm

0.40mm

0.40mm

 Image Distortion

+/- 0.15mm

+/- 0.10mm

+/-0.10mm

 Gold Thickness Range

1-3uinch

1-3uinch

n/a

 Open / Short Testing

Flying Probe/ E-test

Flying Probe/ E-test

Flying Probe/ E-test

 Bow & Twist

< Diagonal length 0.45%

< Diagonal length 0.45%

< Diagonal length 0.75%

 Surface Treatment

 LF HASL Thickness Range

80 - 1000uinch

80 - 1000uinch

80 - 1000uinch

 OSP Thickness Range (min size)

0.15 - 0.25um

0.15 - 0.30um

0.15 - 0.30um

 Electroless Nickel Thickness

80 - 240uinch

80 - 240uinch

n/a

 Electroless Gold Thickness

1 - 3uinch

1 - 3uinch

n/a

 Electrolytic Gold Thickness

1 - 48uinch

1 - 48uinch

n/a

 Flux Thickness Range

0.40 - 0.80um

0.40 - 0.80um

n/a

 Carbon Print Resistance

< 330 ohm/ SQ area

< 330 ohm/ SQ area

n/a